Contamination of Substrate-Coating Interface Caused by Ion Etching

نویسندگان

چکیده

In–situ cleaning of the substrate surface by ion etching is an integral part all physical vapor deposition (PVD) processes. However, in industrial systems, some side effects occur during process that can cause re-contamination. For example, a magnetron sputtering system with several sputter sources and holder located centered between them, causes contamination unshielded target surfaces batching material. In initial stage deposition, this material redeposited back on surface. The identification layer at substrate–coating interface difficult because it contains both coating elements. To avoid problem, we prepared TiAlN double two separate production batches same substrate. such double-layer hard coating, layer, formed before second readily identifiable, analysis its chemical composition easy. Contamination was observed also seed particles caused formation nodular defects. We explain origin these mechanism their transfer from to By comparison area after first layers, changes topography were analyzed. found roughness slightly decreased, which planarization effect.

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ژورنال

عنوان ژورنال: Coatings

سال: 2022

ISSN: ['2079-6412']

DOI: https://doi.org/10.3390/coatings12060846